SEMICONDUCTOR & ELECTRONICS
Global Next Generation Memory Market - Industry Trends and Forecast to 2032
REPORT OVERVIEW
Global Next Generation Memory Market, By Technology (Non-volatile Memory, Volatile Memory), Wafer Size (200 mm, 300 mm), Storage Type (Mass Storage, Embedded Storage, Others), Application (Consumer Electronics, Enterprise Storage, Automotive & Transportation, Military & Aerospace, Industrial, Telecommunications, Energy & Power, Healthcare, Agricultural, and Others), Region (North America, Europe, Asia-Pacific, South America, Middle East and Africa) – Industry Trends and Forecast to 2032.
Market Insights
Market Dynamics
- Rising data generation and need for fast access.
- Increasing use of high-performance computing (HPC).
- High costs associated with next-gen memory technologies.
- Complexity in manufacturing processes.
- Growth in consumer electronics and smart devices.
- Expansion into automotive and industrial applications.
- Rapid technological changes and need for continuous innovation.
- Integration with existing infrastructure and systems.
SEGMENTATION
- Technology
- Non-volatile Memory
- Magneto-Resistive Random-Access Memory (MRAM)
- Ferroelectric RAM (FRAM)
- Resistive Random-Access Memory (ReRAM)
- 3D Xpoint
- Nano RAM
- Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
- Volatile Memory
- Hybrid Memory Cube (HMC)
- High-Bandwidth Memory (HBM)
- Wafer Size
- 200 mm
- 300 mm
- Storage Type
- Mass Storage
- Embedded Storage
- Others
- Application
- Consumer Electronics
- Enterprise Storage
- Automotive & Transportation
- Military & Aerospace
- Industrial
- Telecommunications
- Energy & Power
- Healthcare
- Agricultural
- Others
- North America
- U.S.
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- U.K.
- France
- Italy
- Spain
- Russia
- The Netherlands
- Belgium
- Turkey
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Singapore
- Malaysia
- Australia
- Thailand
- Philippines
- Rest of Asia-Pacific
- South America
- Brazil
- Argentina
- Chile
- Colombia
- Rest of South America
- Middle East and Africa
- Kingdom of Saudi Arabia
- South Africa
- U.A.E.
- Egypt
- Rest of Middle East and Africa
KEY MARKET PLAYERS
- Samsung Electronics Co. Ltd.
- Micron Technology, Inc.
- Fujitsu Limited
- Toshiba Corporation
- Honeywell International, Inc.
- Microchip Technology, Inc.
- Everspin Technologies, Inc.
- Infineon Technologies AG
- Kingston Technology Company, Inc.
- Intel Corporation
Table OF CONTENTS
- SECTION 1 - INTRODUCTION
- 1.1 Taxonomy
- 1.2 Market Overview
- 1.3 Currency and Limitations
- 1.3.1 Currency
- 1.3.2 Limitations
- 1.4 Key Competitors
- SECTION 2 - RESEARCH METHODOLOGY
- 2.1 Research Approach
- 2.2 Data Collection and Validation
- 2.2.1 Secondary Research
- 2.2.2 Primary Research
- 2.3 Market Assessment
- 2.3.1 Market Size Estimation
- 2.3.2 Bottom-up Approach
- 2.3.3 Top-down Approach
- 2.3.4 Growth Forecast
- 2.4 Market Study Assumptions
- 2.5 Data Sources
- SECTION 3 - EXECUTIVE SUMMARY
- 3.1 Global Next Generation Memory Market, by Technology
- 3.2 Global Next Generation Memory Market, by Wafer Size
- 3.3 Global Next Generation Memory Market, by Storage Type
- 3.4 Global Next Generation Memory Market, by Application
- 3.5 Global Next Generation Memory Market, by Geography
- 3.6 Market Position Grid
- SECTION 4 - PREMIUM INSIGHTS
- 4.1 Regulatory Framework
- 4.1.1 Standards
- 4.1.2 Regulatory Landscape
- 4.2 Value Chain Analysis
- 4.3 Supply Chain Analysis
- 4.4 COVID-19 Impact
- 4.5 Russia-Ukraine War Impact
- 4.6 PORTER's Five Force Analysis
- 4.7 PESTLE Analysis
- 4.8 SWOT Analysis
- 4.9 Go to Market Strategy
- 4.10 Opportunity Orbit
- 4.11 Multivariate Modelling
- 4.12 Pricing Analysis
- SECTION 5 - MARKET DYNAMICS
- 5.1 Trends
- 5.1.1 Rapid advancements in-memory technology
- 5.1.2 Adoption of AI and IoT driving memory requirements.
- 5.1.3 Trend 3
- 5.2 Drivers
- 5.2.1 Rising data generation and need for fast access.
- 5.2.2 Increasing use of high-performance computing (HPC).
- 5.2.3 Driver 3
- 5.2.4 Driver 4
- 5.3 Restraints
- 5.3.1 High costs associated with next-gen memory technologies.
- 5.3.2 Complexity in Manufacturing Processes.
- 5.3.3 Restraint 3
- 5.4 Opportunities
- 5.4.1 Growth in consumer electronics and smart devices.
- 5.4.2 Expansion into automotive and industrial applications.
- 5.4.3 Opportunity 3
- 5.4.4 Opportunity 4
- 5.5 Challenges
- 5.5.1 Rapid technological changes and need for continuous innovation.
- 5.5.2 Integration with existing infrastructure and systems.
- 5.5.3 Challenge 3
- SECTION 6 - GLOBAL NEXT GENERATION MEMORY MARKET, BY TECHNOLOGY
- 6.1 Technology Summary
- 6.2 Market Attractive Index
- 6.3 Global Next Generation Memory Market, by Technology (2019-2032)
- SECTION 7 - GLOBAL NEXT GENERATION MEMORY MARKET, BY WAFER SIZE
- 7.1 Wafer Size Summary
- 7.2 Market Attractive Index
- 7.3 Global Next Generation Memory Market, by Wafer Size (2019-2032)
- SECTION 8 - GLOBAL NEXT GENERATION MEMORY MARKET, BY STORAGE TYPE
- 8.1 Storage Type Summary
- 8.2 Market Attractive Index
- 8.3 Global Next Generation Memory Market, by Storage Type (2019-2032)
- SECTION 9 - GLOBAL NEXT GENERATION MEMORY MARKET, BY APPLICATION
- 9.1 Application Summary
- 9.2 Market Attractive Index
- 9.3 Global Next Generation Memory Market, by Application (2019-2032)
- SECTION 10 - GLOBAL NEXT GENERATION MEMORY MARKET, BY GEOGRAPHY
- 10.1 Regional Summary
- 10.2 Market Attractive Index
- 10.3 Global Next Generation Memory Market, by Geography (2019-2032)
- SECTION 11 - NORTH AMERICA NEXT GENERATION MEMORY MARKET
- 11.1 North America Summary
- 11.2 Market Attractive Index
- 11.3 North America Next Generation Memory Market, by Technology (2019-2032)
- 11.4 North America Next Generation Memory Market, by Wafer Size (2019-2032)
- 11.5 North America Next Generation Memory Market, by Storage Type (2019-2032)
- 11.6 North America Next Generation Memory Market, by Application (2019-2032)
- 11.7 North America Next Generation Memory Market, by Country (2019-2032)
- 11.7.1 U.S.
- 11.7.2 Canada
- 11.7.3 Mexico
- 11.7.4 Rest of North America
- SECTION 12 - EUROPE NEXT GENERATION MEMORY MARKET
- 12.1 Europe Summary
- 12.2 Market Attractive Index
- 12.3 Europe Next Generation Memory Market, by Technology (2019-2032)
- 12.4 Europe Next Generation Memory Market, by Wafer Size (2019-2032)
- 12.5 Europe Next Generation Memory Market, by Storage Type (2019-2032)
- 12.6 Europe Next Generation Memory Market, by Application (2019-2032)
- 12.7 Europe Next Generation Memory Market, by Country (2019-2032)
- 12.7.1 Germany
- 12.7.2 U.K.
- 12.7.3 France
- 12.7.4 Italy
- 12.7.5 Spain
- 12.7.6 Russia
- 12.7.7 The Netherlands
- 12.7.8 Belgium
- 12.7.9 Turkey
- 12.7.10 Rest of Europe
- SECTION 13 - ASIA-PACIFIC NEXT GENERATION MEMORY MARKET
- 13.1 Asia-Pacific Summary
- 13.2 Market Attractive Index
- 13.3 Asia-Pacific Next Generation Memory Market, by Technology (2019-2032)
- 13.4 Asia-Pacific Next Generation Memory Market, by Wafer Size (2019-2032)
- 13.5 Asia-Pacific Next Generation Memory Market, by Storage Type (2019-2032)
- 13.6 Asia-Pacific Next Generation Memory Market, by Application (2019-2032)
- 13.7 Asia-Pacific Next Generation Memory Market, by Country (2019-2032)
- 13.7.1 China
- 13.7.2 India
- 13.7.3 Japan
- 13.7.4 South Korea
- 13.7.5 Singapore
- 13.7.6 Malaysia
- 13.7.7 Australia
- 13.7.8 Thailand
- 13.7.9 Philippines
- 13.7.10 Rest of Asia-Pacific
- SECTION 14 - SOUTH AMERICA NEXT GENERATION MEMORY MARKET
- 14.1 South America Summary
- 14.2 Market Attractive Index
- 14.3 South America Next Generation Memory Market, by Technology (2019-2032)
- 14.4 South America Next Generation Memory Market, by Wafer Size (2019-2032)
- 14.5 South America Next Generation Memory Market, by Storage Type (2019-2032)
- 14.6 South America Next Generation Memory Market, by Application (2019-2032)
- 14.7 South America Next Generation Memory Market, by Country (2019-2032)
- 14.7.1 Brazil
- 14.7.2 Argentina
- 14.7.3 Chile
- 14.7.4 Colombia
- 14.7.5 Rest of South America
- SECTION 15 - MIDDLE EAST AND AFRICA NEXT GENERATION MEMORY MARKET
- 15.1 Middle East and Africa Summary
- 15.2 Market Attractive Index
- 15.3 Middle East and Africa Next Generation Memory Market, by Technology (2019-2032)
- 15.4 Middle East and Africa Next Generation Memory Market, by Wafer Size (2019-2032)
- 15.5 Middle East and Africa Next Generation Memory Market, by Storage Type (2019-2032)
- 15.6 Middle East and Africa Next Generation Memory Market, by Application (2019-2032)
- 15.7 Middle East and Africa Next Generation Memory Market, by Country (2019-2032)
- 15.7.1 Kingdom of Saudi Arabia
- 15.7.2 South Africa
- 15.7.3 U.A.E.
- 15.7.4 Egypt
- 15.7.5 Rest of Middle East and Africa
- SECTION 16 - COMPANY SHARE ANALYSIS
- 16.1 Global Next Generation Memory Market, Company Share Analysis
- 16.2 North America Next Generation Memory Market, Company Share Analysis
- 16.3 Europe Next Generation Memory Market, Company Share Analysis
- 16.4 Asia-Pacific Next Generation Memory Market, Company Share Analysis
- SECTION 17 - COMPANY PROFILES
- 17.1 Samsung Electronics Co. Ltd.
- 17.1.1 Company Snapshot
- 17.1.2 Financial Overview
- 17.1.3 Product Portfolio
- 17.1.4 Recent Developments
- 17.2 Micron Technology, Inc.
- 17.2.1 Company Snapshot
- 17.2.2 Financial Overview
- 17.2.3 Product Portfolio
- 17.2.4 Recent Developments
- 17.3 Fujitsu Limited
- 17.3.1 Company Snapshot
- 17.3.2 Financial Overview
- 17.3.3 Product Portfolio
- 17.3.4 Recent Developments
- 17.4 Toshiba Corporation
- 17.4.1 Company Snapshot
- 17.4.2 Financial Overview
- 17.4.3 Product Portfolio
- 17.4.4 Recent Developments
- 17.5 Honeywell International, Inc.
- 17.5.1 Company Snapshot
- 17.5.2 Financial Overview
- 17.5.3 Product Portfolio
- 17.5.4 Recent Developments
- 17.6 Microchip Technology, Inc.
- 17.6.1 Company Snapshot
- 17.6.2 Financial Overview
- 17.6.3 Product Portfolio
- 17.6.4 Recent Developments
- 17.7 Everspin Technologies, Inc.
- 17.7.1 Company Snapshot
- 17.7.2 Financial Overview
- 17.7.3 Product Portfolio
- 17.7.4 Recent Developments
- 17.8 Infineon Technologies AG
- 17.8.1 Company Snapshot
- 17.8.2 Financial Overview
- 17.8.3 Product Portfolio
- 17.8.4 Recent Developments
- 17.9 Kingston Technology Company, Inc.
- 17.9.1 Company Snapshot
- 17.9.2 Financial Overview
- 17.9.3 Product Portfolio
- 17.9.4 Recent Developments
- 17.10 Intel Corporation
- 17.10.1 Company Snapshot
- 17.10.2 Financial Overview
- 17.10.3 Product Portfolio
- 17.10.4 Recent Developments
- SECTION 18 - RELATED REPORTS
- SECTION 19 - DISCLAIMER
RESEARCH METHODOLOGY
RESEARCH AND DATA COLLECTION
- Research articles published on Technium
- Science and MDPI
- Research publications by government approved associations and societies
DATA PRE-PROCESSING
The term "data pre-processing" refers to the collection of procedures and methods used to clean, modify, and make ready for analysis the raw data gathered during research and data collection. The completion of this phase is necessary to guarantee that the data are reliable, consistent, and appropriate for statistical analysis and other data-driven tasks. The data pre-processing ensures that the information gathered from research and data collection is comparable and expressed in standard units, by the integration of missing data pointers and algorithmic approaches.
MODELING AND FORECASTING
QUALITY ASSURANCE AND OUTPUT
Quality assurance and output involves the process of validation, adjustments, further publications of key market indicators. Extensive plausibility and consistency tests are performed on derived time series to ensure the high degree of quality of our market analysis. This quality assurance procedure also includes rigorous inspection, validation, and editing by an experienced management team to assure the dependability of the published data.